发明申请
US20160243593A1 SUBSTRATE CLEANING APPARATUS,SUBSTRATE CLEANING METHOD, AND SUBSTRATE PROCESSING APPARATUS
审中-公开
基板清洗装置，基板清洗方法和基板处理装置
- 专利标题： SUBSTRATE CLEANING APPARATUS,SUBSTRATE CLEANING METHOD, AND SUBSTRATE PROCESSING APPARATUS
- 专利标题（中）： 基板清洗装置，基板清洗方法和基板处理装置
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申请号： US15045045申请日： 2016-02-16
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公开(公告)号： US20160243593A1公开(公告)日： 2016-08-25
- 发明人: Hideaki TANAKA
- 申请人： EBARA CORPORATION
- 优先权： JP2015-029666 20150218; JP2015-046292 20150309
- 主分类号： B08B1/00
- IPC分类号： B08B1/00 ; B08B3/08 ; B08B3/02 ; H01L21/306 ; B24B37/11 ; H01L21/67 ; H01L21/687 ; H01L21/02 ; B08B1/04 ; B08B5/04
摘要：
A substrate cleaning apparatus for cleaning a substrate while rotating the substrate and placing a cleaning member in contact with the rotating substrate is disclosed. The substrate cleaning apparatus comprises: a self-cleaning member mounted to an arm supporting the cleaning member, the self-cleaning member being configured to come into contact with the cleaning member to perform self-cleaning of the cleaning member; and a moving mechanism mounted to the arm supporting the cleaning member, the moving mechanism being configured to move the self-cleaning member between a position where the self-cleaning member is in contact with the cleaning member and a position where the self-cleaning member is separated from the cleaning member.
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