Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14662697Application Date: 2015-03-19
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Publication No.: US20160276449A1Publication Date: 2016-09-22
- Inventor: DONG-IL BAE , Bomsoo KIM , Yong-Min CHO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L21/308 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L29/45

Abstract:
An semiconductor device is provided. A fin is disposed on a substrate, extending in a lengthwise direction. A first recess is disposed on a sidewall of the fin so that the fin 7and the first recess is arranged in a straight line along the lengthwise direction. A gate structure crosses the fin in the first direction crossing the lengthwise direction. A spacer is disposed on sidewalk of the gate structure. A source/drain region is disposed in the first recess. The source/drain region is formed under the spacer. A silicide layer is disposed on the source/drain region. The silicide layer and the source/drain region fill the first recess.
Public/Granted literature
Information query
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