Invention Application
- Patent Title: SEMICONDUCTOR DEVICES HAVING BRIDGE LAYER AND METHODS OF MANUFACTURING THE SAME
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Application No.: US15177421Application Date: 2016-06-09
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Publication No.: US20160284703A1Publication Date: 2016-09-29
- Inventor: Seok-Hoon Kim , Jin-Bum Kim , Kwan-Heum Lee , Byeong-Chan Lee , Cho-Eun Lee , Jin-Hee Han , Bon-Young Koo
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0057209 20140513
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/78 ; H01L21/8234 ; H01L27/092

Abstract:
A semiconductor device includes a substrate, a first active fin and a second active fin on the substrate, respectively, a plurality of first epitaxial layers on the first active fin and on the second active fin, respectively, a plurality of second epitaxial layers on the plurality of first epitaxial layers, a bridge layer connecting the plurality of second epitaxial layers to each other, and a third epitaxial layer on the bridge layer.
Public/Granted literature
- US09735158B2 Semiconductor devices having bridge layer and methods of manufacturing the same Public/Granted day:2017-08-15
Information query
IPC分类: