Invention Application
- Patent Title: SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
- Patent Title (中): 基板处理装置和基板处理方法
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Application No.: US14836145Application Date: 2015-08-26
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Publication No.: US20160293400A1Publication Date: 2016-10-06
- Inventor: Shinsuke KIMURA , Tatsuhiko KOIDE , Yoshihiro OGAWA
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Priority: JP2015-075015 20150401
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/306
Abstract:
In one embodiment, a substrate treatment apparatus includes a housing configured to house a substrate. The apparatus further includes a chemical supplying module configured to supply one or more chemicals in a gas state to the substrate in the housing, the one or more chemicals including a first chemical that contains a silylation agent. The apparatus further includes a cooling module configured to cool the substrate in the housing while any of the one or more chemicals is supplied to the substrate in the housing.
Public/Granted literature
- US09748091B2 Substrate treatment apparatus and substrate treatment method Public/Granted day:2017-08-29
Information query
IPC分类:
