Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US14689968Application Date: 2015-04-17
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Publication No.: US20160307950A1Publication Date: 2016-10-20
- Inventor: ZEN-FONG HUANG , VOLUME CHIEN , SU-HUA CHANG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A semiconductor structure includes a substrate including a first side and a second side disposed opposite to the first side and configured to receive an electromagnetic radiation, a barrier layer disposed over the second side of the substrate, a color filter disposed over the barrier layer, and a grid surrounding the color filter and disposed over the barrier layer, wherein the barrier layer is configured to absorb or reflect non-visible light in the electromagnetic radiation, and the barrier layer is disposed between the grid and the substrate.
Public/Granted literature
- US10515991B2 Semiconductor structure and manufacturing method thereof Public/Granted day:2019-12-24
Information query
IPC分类: