Invention Application
- Patent Title: MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSIONS OF CONDUCTIVE VIAS PROTRUDING FROM THROUGH-HOLES PASSING THROUGH SUBSTRATES
- Patent Title (中): 具有特征的微电子元件包裹在通过基底穿透的孔中进行的导电六面体的挤压
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Application No.: US15200554Application Date: 2016-07-01
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Publication No.: US20160315047A1Publication Date: 2016-10-27
- Inventor: Cyprian Emeka Uzoh , Charles G. Woychik , Arkalgud R. Sitaram , Hong Shen , Zhuowen Sun , Liang Wang , Guilian Gao
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768 ; H01L49/02
Abstract:
In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, conductive features (120E.A, 120E.B) are provided above the substrate that wrap around the conductive vias' protrusions (114′) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.
Public/Granted literature
Information query
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