发明申请
US20160316556A1 HIGH PERFORMANCE, ULTRA LOW LOSS, ULTRA LIGHTWEIGHT, MULTI-LAYERED RIGID CIRCUIT BOARDS
审中-公开
高性能，超低损耗超声波，多层刚性电路板
- 专利标题： HIGH PERFORMANCE, ULTRA LOW LOSS, ULTRA LIGHTWEIGHT, MULTI-LAYERED RIGID CIRCUIT BOARDS
- 专利标题（中）： 高性能，超低损耗超声波，多层刚性电路板
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申请号： US14692559申请日： 2015-04-21
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公开(公告)号： US20160316556A1公开(公告)日： 2016-10-27
- 发明人: Daniel J. Braley , Eric G. Barnes , Pedro Gonzalez
- 申请人： NORTHROP GRUMMAN SYSTEMS CORPORATION
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; B29C67/00 ; H05K1/03 ; H05K3/10
摘要：
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
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