Abstract:
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
Abstract:
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
Abstract:
A system and method for producing a uniform continuous fiber filament. The system and method include a fiber tow with an axial magnet attached to an end of the fiber tow, a polymer tube, and a radial magnet that fits around a circumference of the polymer tube. The radial and axial magnets are used to feed the fiber tow through the polymer tube using magnetic forces to create the uniform continuous fiber filament.