公开(公告)号：US10129976B2

公开(公告)日：2018-11-13

申请号：US14692559

申请日：2015-04-21

申请人： NORTHROP GRUMMAN SYSTEMS CORPORATION

发明人： Daniel J. Braley ,  Eric G. Barnes ,  Pedro Gonzalez

IPC分类号： B29C64/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/46 ,  B33Y80/00 ,  H05K3/10 ,  B33Y70/00 ,  B29C64/106 ,  H05K3/12 ,  B29K23/00 ,  B29K305/00 ,  B29L31/34

摘要： An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.

公开(公告)号：US20160316556A1

公开(公告)日：2016-10-27

申请号：US14692559

申请日：2015-04-21

申请人： NORTHROP GRUMMAN SYSTEMS CORPORATION

发明人： Daniel J. Braley ,  Eric G. Barnes ,  Pedro Gonzalez

IPC分类号： H05K1/09 ,  B29C67/00 ,  H05K1/03 ,  H05K3/10

CPC分类号： H05K1/09 ,  B29C64/106 ,  B29K2023/0666 ,  B29K2305/00 ,  B29L2031/3425 ,  B33Y70/00 ,  B33Y80/00 ,  H05K1/032 ,  H05K1/0393 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/4664 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2203/0126

摘要： An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.

摘要翻译： 通过使用仅使用三维打印机共挤出超高分子量聚乙烯（UHMWPE）丝，例如Dyneema灯丝和导电材料（例如Indalloy线）制造的诸如电路板的电子部件， 例如FDM机器。