Invention Application
- Patent Title: Ion Source for Metal Implantation and Methods Thereof
- Patent Title (中): 金属植入物的离子源及其方法
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Application No.: US14701320Application Date: 2015-04-30
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Publication No.: US20160322198A1Publication Date: 2016-11-03
- Inventor: Ewald Wiltsche , Peter Zupan , Werner Schustereder , Moriz Jelinek , Robert Eberwein , Friedrich Kroener
- Applicant: Infineon Technologies AG
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01L21/67 ; C23C14/16 ; C23C14/34 ; H01J37/08 ; C23C14/48

Abstract:
An ion source for an implanter includes a first solid state source electrode disposed in an ion source chamber. The first solid state source electrode includes a source material coupled to a first negative potential node. A second solid state source electrode is disposed in the ion source chamber. The second solid state source electrode includes the source material coupled to a second negative potential node, and the first solid state source electrode and the second solid state source electrode are configured to produce ions to be implanted by the implanter.
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