发明申请
US20160330845A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
审中-公开
感光性树脂组合物，感光元件，形成电阻图案的方法以及印刷线路板的制造方法
- 专利标题： PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
- 专利标题（中）： 感光性树脂组合物，感光元件，形成电阻图案的方法以及印刷线路板的制造方法
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申请号： US15107858申请日： 2014-12-22
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公开(公告)号： US20160330845A1公开(公告)日： 2016-11-10
- 发明人: Shota OKADE , Masahiro MIYASAKA , Yukiko MURAMATSU
- 申请人： HITACHI CHEMICAL COMPANY, LTD.
- 优先权： JP2013-271831 20131227
- 国际申请： PCT/JP2014/083965 WO 20141222
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; G03F7/20 ; G03F7/38 ; C25D7/12 ; C23C18/16 ; C25D3/12 ; C25D3/38 ; C25D3/48 ; G03F7/033 ; G03F7/32
摘要：
A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or α-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.