Invention Application
- Patent Title: METHOD OF REPLACING AN EXISTING CONTACT OF A WAFER PROBING ASSEMBLY
- Patent Title (中): 替换现有接触器的方法
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Application No.: US15222113Application Date: 2016-07-28
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Publication No.: US20160334465A1Publication Date: 2016-11-17
- Inventor: Kenneth R. Smith
- Applicant: Cascade Microtech, Inc.
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.
Public/Granted literature
- US10267848B2 Method of electrically contacting a bond pad of a device under test with a probe Public/Granted day:2019-04-23
Information query
