Invention Application
- Patent Title: Separation Apparatus
- Patent Title (中): 分离装置
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Application No.: US15165099Application Date: 2016-05-26
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Publication No.: US20160347047A1Publication Date: 2016-12-01
- Inventor: Saki Eguchi , Koichi TAKESHIMA , Hiroki ADACHI
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Priority: JP2015-107024 20150527
- Main IPC: B32B43/00
- IPC: B32B43/00 ; H01L21/683

Abstract:
A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.
Public/Granted literature
- US09849660B2 Separation apparatus Public/Granted day:2017-12-26
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