In one embodiment, a light emitting device package includes a light emitting device including a substrate and a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, stacked on the substrate; a reflective conductive layer provided on the light emitting structure; and a first electrode and a second electrode overlying the reflective conductive layer separated from each other in a first region. The first electrode and the second electrode are electrically insulated from the reflective metal layer and penetrate through the reflective metal layer to be electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively.