Invention Application
US20160362795A1 METHOD FOR FORMING CERAMIC COATING HAVING IMPROVED PLASMA RESISTANCE AND CERAMIC COATING FORMED THEREBY
审中-公开
形成具有改进的等离子体电阻和陶瓷涂层的陶瓷涂层的方法
- Patent Title: METHOD FOR FORMING CERAMIC COATING HAVING IMPROVED PLASMA RESISTANCE AND CERAMIC COATING FORMED THEREBY
- Patent Title (中): 形成具有改进的等离子体电阻和陶瓷涂层的陶瓷涂层的方法
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Application No.: US15112086Application Date: 2014-12-04
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Publication No.: US20160362795A1Publication Date: 2016-12-15
- Inventor: Mun Ki Lee , Byung Ki Kim , Jae Hyuk Park , Dae Gean Kim , Myoung No Lee
- Applicant: IONES CO., LTD.
- Priority: KR10-2014-0006146 20140117; KR10-2014-0006147 20140117; KR10-2014-0006148 20140117; KR10-2014-0006149 20140117
- International Application: PCT/KR2014/011796 WO 20141204
- Main IPC: C23C24/04
- IPC: C23C24/04 ; C23C16/458 ; C04B35/447 ; C04B35/622 ; C04B35/505 ; C23C16/44 ; H01J37/32

Abstract:
The present invention relates to a method for forming a ceramic coating having improved plasma resistance and a ceramic coating formed thereby. The present invention discloses the method for forming the ceramic coating having improved plasma resistance and the ceramic coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of ceramic powders having a first powder particle size range, and transporting the powders using a transport gas; and forming a ceramic coating in which a plurality of first ceramic particles within a first coating particle size range and a plurality of second ceramic particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported ceramic powders to collide with a substrate inside a process chamber, at the speed of 100 to 500 m/s so as to be pulverized.
Public/Granted literature
- US10982331B2 Method for forming ceramic coating having improved plasma resistance and ceramic coating formed thereby Public/Granted day:2021-04-20
Information query
IPC分类: