Invention Application
US20170029664A1 POLISHING COMPOSITIONS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
审中-公开
抛光组合物及使用其制造半导体器件的方法
- Patent Title: POLISHING COMPOSITIONS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
- Patent Title (中): 抛光组合物及使用其制造半导体器件的方法
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Application No.: US15214847Application Date: 2016-07-20
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Publication No.: US20170029664A1Publication Date: 2017-02-02
- Inventor: Seung-Ho PARK , Ki-Hwa JUNG , Sang-Kyun KIM , Jun-Ha HWANG , Chang-Gil KWON , Seung-Yeop BAEK , Jae-Woo LEE , Ji-Sung LEE , Jae-Kwang CHOI , Jin-Myung HWANG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Anseong-si
- Assignee: K.C. Tech Co., Ltd.
- Current Assignee: K.C. Tech Co., Ltd.
- Current Assignee Address: KR Anseong-si
- Priority: KR10-2015-0102312 20150720
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L29/06 ; H01L21/3105 ; H01L21/762
Abstract:
A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
Public/Granted literature
- US10435587B2 Polishing compositions and methods of manufacturing semiconductor devices using the same Public/Granted day:2019-10-08
Information query
