中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

43 records (took 0.026 seconds)

    Membrane assembly and carrier head having the membrane assembly
    1.
    发明授权
    Membrane assembly and carrier head having the membrane assembly 有权
    膜组件和具有膜组件的载体头

    公开(公告)号：US08939817B2

    公开(公告)日：2015-01-27

    申请号：US13482043

    申请日：2012-05-29

    Applicant: Jun Ho Son

    Inventor： Jun Ho Son

    IPC: B24B5/02 ,  B24B37/30 ,  B24B41/06

    CPC classification number: B24B37/30 ,  B24B41/061

    Abstract: Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion.

    Abstract translation: 提供了一种在化学机械抛光装置中的载体头的膜组件。 膜组件包括主膜和圆环。 主要的膜具有与晶片接触的晶片接触表面，同时进行化学机械抛光工艺。 圆环设置在主膜的边缘部分处，并且接收空气压力以在边缘部分向下施加空气压力到主膜。

    Chemical mechanical polishing system
    2.
    发明授权
    Chemical mechanical polishing system 有权
    化学机械抛光系统

    公开(公告)号：US08882563B2

    公开(公告)日：2014-11-11

    申请号：US13095404

    申请日：2011-04-27

    Applicant: Jae Phil Boo ,  Dong Soo Kim ,  Keon Sik Seo ,  Chan Woon Jeon ,  Jun Ho Ban ,  Ja Cheul Goo

    Inventor： Jae Phil Boo ,  Dong Soo Kim ,  Keon Sik Seo ,  Chan Woon Jeon ,  Jun Ho Ban ,  Ja Cheul Goo

    IPC: B24B49/00 ,  B24B5/00 ,  B24B37/30 ,  B24B37/34

    CPC classification number: B24B37/345 ,  B24B37/30

    Abstract: The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.

    Abstract translation: 本发明涉及一种化学机械抛光系统，包括：至少一个抛光盘，其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元，其包括旋转接头，用于在抛光过程中向基板施加压力，所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元，其安装成对接到基板载体单元，以便当基板载体单元位于抛光平台上时，向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力，由此即使 衬底载体单元移动以连续地抛光多个抛光平板上的衬底，基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。

    Conditioner of chemical mechanical polishing apparatus
    3.
    发明授权
    Conditioner of chemical mechanical polishing apparatus 有权
    化学机械抛光装置的护发素

    公开(公告)号：US08662956B2

    公开(公告)日：2014-03-04

    申请号：US13099401

    申请日：2011-05-03

    Applicant: Keon Sik Seo ,  Jae Phil Boo ,  Dong Soo Kim ,  Ja Cheul Goo ,  Chan Woon Jeon ,  Jnn Ho Ban

    Inventor： Keon Sik Seo ,  Jae Phil Boo ,  Dong Soo Kim ,  Ja Cheul Goo ,  Chan Woon Jeon ,  Jnn Ho Ban

    IPC: B24B53/00 ,  B24B1/00

    CPC classification number: B24B53/017 ,  B24B49/16

    Abstract: Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.

    Abstract translation: 提供一种用于在旋转的压板上抛光基板的化学机械抛光装置的调节器及其方法。 调节器包括盘保持器，活塞杆，壳体和负载传感器。 盘保持器固定调节盘，该调节盘精细地切割压板垫的表面。 活塞杆向盘保持器施加法向力。 壳体覆盖活塞杆的至少一部分。 安装负载传感器以接收活塞杆传递到活塞杆并测量法向力的法向力。

    CMP slurry, preparation method thereof and method of polishing substrate using the same
    5.
    发明授权
    CMP slurry, preparation method thereof and method of polishing substrate using the same 有权
    CMP浆料，其制备方法和使用其的抛光基材的方法

    公开(公告)号：US08062547B2

    公开(公告)日：2011-11-22

    申请号：US11421965

    申请日：2006-06-02

    Applicant: Un Gyu Paik ,  Jea Gun Park ,  Sang Kyun Kim ,  Ye Hwan Kim ,  Myoung Won Suh ,  Dae Hyeong Kim

    Inventor： Un Gyu Paik ,  Jea Gun Park ,  Sang Kyun Kim ,  Ye Hwan Kim ,  Myoung Won Suh ,  Dae Hyeong Kim

    IPC: C09K13/00

    CPC classification number: C23F3/04 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/3212

    Abstract: A CMP slurry is provided comprising polishing particles, the polishing particle comprising organically modified colloidal silica. Also, a method of preparing a CMP slurry is provided, comprising the steps of: preparing polishing particles comprising organically modified silica; converting the polishing particles into an aqueous state; and adding pure water, a hydrophilic additive and a dispersing agent to the polishing particles. The polishing particles can be synthesized using a sol-gel process. According to the invention, a slurry having excellent polishing properties can be prepared, in which the surface properties of colloidal silica are changed to control the physical properties of the polishing particles and which can ensure a desired CMP removal rate while minimizing the occurrence of scratches.

    Abstract translation: 提供包括抛光颗粒的CMP浆料，抛光颗粒包含有机改性的胶体二氧化硅。 另外，提供了制备CMP浆料的方法，包括以下步骤：制备包含有机改性二氧化硅的抛光颗粒; 将抛光颗粒转化成水状态; 并向抛光颗粒中加入纯水，亲水性添加剂和分散剂。 抛光颗粒可以使用溶胶 - 凝胶法合成。 根据本发明，可以制备具有优异抛光性能的浆料，其中改变胶体二氧化硅的表面性能以控制抛光颗粒的物理性质，并且可以确保所需的CMP去除速率同时最小化划痕的发生。

    NOZZLE FOR SPRAYING SUBLIMABLE SOLID PARTICLES ENTRAINED IN GAS FOR CLEANING SURFACE
    7.
    发明申请
    NOZZLE FOR SPRAYING SUBLIMABLE SOLID PARTICLES ENTRAINED IN GAS FOR CLEANING SURFACE 有权
    用于喷洒在清洁表面的气体中引入的可固体固体颗粒的喷嘴

    公开(公告)号：US20090039178A1

    公开(公告)日：2009-02-12

    申请号：US12061833

    申请日：2008-04-03

    Applicant: Cheol-Nam Yoon

    Inventor： Cheol-Nam Yoon

    IPC: B05B1/24

    CPC classification number: B24C5/04 ,  B24C1/003

    Abstract: A nozzle for spraying sublimable solid particles and preventing frost from forming at surfaces of the nozzle. The nozzle includes: a cleaning agent block for phase-changing a cleaning agent into a snow containing sublimable solid particles; a nozzle block for growing the cleaning agent snow through adiabatic expansion and spraying the grown cleaning agent snow onto a surface of an object; a carrier gas block for supplying a carrier gas to the nozzle block to mix with the cleaning agent snow; and a heater for heating at least a portion of the carrier gas supplied from the carrier gas supply source. Fine dry ice particles and liquid CO2, passing through a solenoid valve from a CO2 reservoir tank and a pressure drop of a flow rate regulation valve, are introduced into the spray nozzle and then mixed with the carrier gas, such as N2 or purified air, and discharged.

    Abstract translation: 用于喷洒可升华的固体颗粒并防止在喷嘴表面形成霜的喷嘴。 喷嘴包括：用于将清洁剂相变成含有可升华的固体颗粒的积雪的清洁剂块; 用于通过绝热膨胀生长清洁剂雪并将生长的清洁剂雪喷洒到物体的表面上的喷嘴块; 用于将载气供应到喷嘴块以与清洁剂雪混合的载气块; 以及用于加热从载气供给源供给的至少一部分载气的加热器。 通过来自二氧化碳储存罐的电磁阀和流量调节阀的压降的精细干冰颗粒和液体CO 2被引入到喷嘴中，然后与载气如N 2或净化空气混合， 并出院。

    Abrasive particles, polishing slurry, and producing method thereof
    8.
    发明申请
    Abrasive particles, polishing slurry, and producing method thereof 审中-公开
    磨料颗粒，抛光浆料及其制备方法

    公开(公告)号：US20060156635A1

    公开(公告)日：2006-07-20

    申请号：US11305535

    申请日：2005-12-16

    Applicant: Dae Kim ,  Seok Hong ,  Yong Kim ,  Dong Kim ,  Myoung Suh ,  Jea Park ,  Un Paik

    Inventor： Dae Kim ,  Seok Hong ,  Yong Kim ,  Dong Kim ,  Myoung Suh ,  Jea Park ,  Un Paik

    IPC: C09K3/14

    CPC classification number: C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

    Abstract: Disclosed herein is a polishing slurry for use in an STI CMP process, necessary for fabricating ultra highly integrated semiconductors of 256 mega D-RAM or more (Design rule of 0.13 μm or less), which can polish wafers at a high removal rate, having an excellent the removal selectivity of oxide compared to nitride. The polishing slurry can be applied to various patterns required in the course of producing ultra highly integrated semiconductors, and thus excellent removal rate, removal selectivity, and within-wafer-nonuniformity (WIWNU), which indicates removal uniformity, as well as minimal occurrence of micro scratches, can be assured.

    Abstract translation: 本文公开了一种用于STI CMP工艺的抛光浆料，其是制造256兆D-RAM以上的超高度集成半导体（设计规则为0.13μm或更小）所必需的，其可以以高去除速度抛光晶片，具有 与氮化物相比，氧化物的去除选择性优异。 研磨浆料可以应用于制造超高度集成半导体的过程中所需的各种图案，因此优异的去除速度，去除选择性和晶片内不均匀性（WIWNU），这表明去除均匀性，以及最小的发生 微划痕，可以放心。

    SUBSTRATE CLEANING APPARATUS AND METHOD AND BRUSH ASSEMBLY USED THEREIN
    9.
    发明申请
    SUBSTRATE CLEANING APPARATUS AND METHOD AND BRUSH ASSEMBLY USED THEREIN 有权
    基板清洁装置及其使用的方法和刷子组件

    公开(公告)号：US20140366913A1

    公开(公告)日：2014-12-18

    申请号：US14301669

    申请日：2014-06-11

    Applicant: K.C. TECH CO., LTD.

    Inventor： Moon Gi CHO ,  Jun Ho SON

    IPC: B08B1/00 ,  B08B1/04

    CPC classification number: H01L21/67046 ,  A46B13/001 ,  B08B1/04

    Abstract: Provided are a substrate cleaning apparatus and method and a brush assembly used therein. The substrate cleaning apparatus for contact-cleaning a substrate includes a cleaning brush rotatably disposed in a cylindrical shape and having an outer circumferential surface contacting the substrate to clean the substrate. Here, the cleaning brush includes a plurality of pressure chambers expanding by a fluid pressure and disposed along a longitudinal direction of a rotation axis rotating at a central portion of the cleaning brush, and the plurality of pressure chambers are individually expandable to allow a portion of the outer circumferential surface to protrude in a radial direction and thus contact-clean a portion of the substrate.

    Abstract translation: 提供了其中使用的基板清洁装置和方法以及刷组件。 用于接触清​​洁基板的基板清洁装置包括可旋转地设置成圆柱形状并具有与基板接触的外周表面以清洁基板的清洁刷。 这里，清洁刷包括多个压力室，其通过流体压力膨胀并且沿着在清洁刷的中心部分处旋转的旋转轴线的纵向方向设置，并且多个压力室单独地可膨胀以允许 所述外圆周表面沿径向突出，从而接触所述基底的一部分。

Patent Agency Ranking