Invention Application
- Patent Title: HYBRID COMPUTING MODULE
- Patent Title (中): 混合计算模块
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Application No.: US15162285Application Date: 2016-05-23
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Publication No.: US20170031413A1Publication Date: 2017-02-02
- Inventor: L. Pierre de Rochemont , Alexander J. Kovacs
- Applicant: L. Pierre de Rochemont , Alexander J. Kovacs
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F13/16 ; H01L25/16 ; G06F9/30 ; G06F9/38 ; H01L25/065 ; G06F12/1009 ; G06F13/24

Abstract:
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core dock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
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