Invention Application
US20170031413A1 HYBRID COMPUTING MODULE 审中-公开
混合计算模块

HYBRID COMPUTING MODULE
Abstract:
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core dock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
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