Invention Application
US20170032964A1 Method for Protecting a Surface of a Substrate and Semiconductor Device
审中-公开
保护基板和半导体器件表面的方法
- Patent Title: Method for Protecting a Surface of a Substrate and Semiconductor Device
- Patent Title (中): 保护基板和半导体器件表面的方法
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Application No.: US15215334Application Date: 2016-07-20
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Publication No.: US20170032964A1Publication Date: 2017-02-02
- Inventor: Daniel Kueck , Guenter Denifl , Werner Eigler , Roland Moennich
- Applicant: Infineon Technologies AG
- Priority: DE102015111891.2 20150722
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L29/06 ; H01L29/16
Abstract:
A Method for protecting a surface of a substrate includes processing the substrate, forming a pyrolytic carbon layer on at least one surface of the substrate, and subjecting the substrate to thermal treatment, specifically above a temperature of about 1300° C., typically above about 1400° C.
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