公开(公告)号：US20170032964A1

公开(公告)日：2017-02-02

申请号：US15215334

申请日：2016-07-20

Applicant: Infineon Technologies AG

Inventor： Daniel Kueck ,  Guenter Denifl ,  Werner Eigler ,  Roland Moennich

IPC: H01L21/04 ,  H01L29/06 ,  H01L29/16

CPC classification number: H01L21/045 ,  H01L21/02527 ,  H01L21/0262 ,  H01L21/046 ,  H01L21/324 ,  H01L29/1608

Abstract: A Method for protecting a surface of a substrate includes processing the substrate, forming a pyrolytic carbon layer on at least one surface of the substrate, and subjecting the substrate to thermal treatment, specifically above a temperature of about 1300° C., typically above about 1400° C.

Abstract translation: 一种用于保护衬底表面的方法包括处理衬底，在衬底的至少一个表面上形成热解碳层，并对衬底进行热处理，特别是高于约1300℃的温度，通常高于约1300℃ 1400°C