A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.