公开(公告)号：US20170033271A1

公开(公告)日：2017-02-02

申请号：US15039303

申请日：2014-11-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas GRUENDL ,  Tobias GEBUHR ,  Markus PINDL

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  G10L2015/223 ,  H01L24/48 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.

Abstract translation: 一种制造光电子部件的方法包括：将由分离区域划分的引线框架提供到第一引线框架部件和第二引线框架部件中，执行其中在第一引线框架的上侧上产生至少一个沟槽结构的蚀刻， 通过在引线框架周围模制成型材料，使得1）形成空腔并暴露第一引线框架部分的上侧的区域和第二引线框架部分的上侧的区域，以及2） 沟槽结构设置在第一引线框架部分的暴露区域的上侧，并且将光电半导体芯片布置在第一引线框架部分的暴露区域的上侧，使得沟槽结构用作对准标记 。

公开(公告)号：US20190157524A1

公开(公告)日：2019-05-23

申请号：US16240584

申请日：2019-01-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US20160293812A1

公开(公告)日：2016-10-06

申请号：US15036413

申请日：2014-10-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

Abstract translation: 本发明涉及一种用于制造多个光电子半导体元件的方法，包括以下步骤：制备在横向彼此间隔开的多个半导体芯片; 形成壳体主体组件，其至少一个区域布置在所述半导体芯片之间; 形成多个圆角，每个圆角相邻半导体芯片，并且由每个半导体芯片和壳体主体组件的侧表面沿横向方向界定; 并且将所述壳体主体组件分离成多个光电子部件，每个部件具有至少一个半导体芯片和所述壳体主体组件的一部分作为壳体主体，并且每个半导体芯片不被所述壳体的材料覆盖在辐射 该表面与安装表面相对的半导体部件的发射表面。 本发明还涉及半导体部件。