Invention Application
- Patent Title: POWER AMPLIFIER MODULE PACKAGE AND PACKAGING METHOD THEREOF
- Patent Title (中): 功率放大器模块封装及其封装方法
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Application No.: US14854098Application Date: 2015-09-15
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Publication No.: US20170040182A1Publication Date: 2017-02-09
- Inventor: Kyung Hak Lee , Min Seok HAN , Young Ki KIM
- Applicant: CENTER FOR INTEGRATED SMART SENSORS FOUNDATION
- Priority: KR10-2015-0111710 20150807
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/057 ; H03F3/21 ; H05K1/11 ; H05K3/10 ; H01L23/08 ; H05K1/03
Abstract:
Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.
Information query
IPC分类:
