发明申请
US20170040187A1 SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
用双面分离器提供的密封片和制造半导体器件的方法
- 专利标题： SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 用双面分离器提供的密封片和制造半导体器件的方法
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申请号： US15106909申请日： 2014-12-22
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公开(公告)号： US20170040187A1公开(公告)日： 2017-02-09
- 发明人: Chie Iino , Tsuyoshi Ishizaka , Kosuke Morita , Goji Shiga
- 申请人： NITTO DENKO CORPORATION
- 优先权： JP2013-270259 20131226
- 国际申请： PCT/JP2014/083928 WO 20141222
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/498 ; H01L21/78 ; C09J183/04 ; H01L23/29 ; C09J163/00 ; C09J7/02 ; H01L21/683 ; H01L23/31
摘要：
A sealing sheet with a double-sided separator, provided with a sealing sheet, a separator (A) laminated on one side of the sealing sheet, and a separator (B) laminated on the other side of the sealing sheet, the separation force F1 between the sealing sheet and the separator (A), the separation force F2 between the sealing sheet and the separator (B), the thickness t of the sealing sheet, and the area A of the sealing sheet satisfying a specific relationship.
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