公开(公告)号：US20170033076A1

公开(公告)日：2017-02-02

申请号：US15106439

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L23/00 ,  H01L21/52 ,  H01L25/00 ,  H01L21/78

CPC分类号： H01L24/83 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L21/7806 ,  H01L23/12 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16146 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83203 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/83005

摘要： Provided is a production method for a semiconductor package making it possible to embed, in its irregularities, a thermosetting resin sheet satisfactorily. The method is a production method, for a semiconductor package, including the step of forming a sealed body by pressurizing a stacked body which includes: a chip-temporarily-fixed body comprising a supporting plate, a temporarily-fixing material stacked over the supporting plate, and a semiconductor chip fixed temporarily over the temporarily-fixing material; a thermosetting resin sheet arranged over the chip-temporarily-fixed body; and a separator having a tensile storage elastic modulus of 200 MPa or less at 90° C. and arranged over the thermosetting resin sheet; the sealed body including the semiconductor chip and the thermosetting resin sheet covering the semiconductor chip.

摘要翻译： 提供一种半导体封装的制造方法，其可以令人满意地嵌入其不规则的热固性树脂片。 该方法是一种用于半导体封装的制造方法，其包括通过对叠层体进行加压而形成密封体的步骤，所述堆叠体包括：芯片临时固定体，包括支撑板，叠置在支撑板上的临时固定材料 以及临时固定在临时固定材料上的半导体芯片; 布置在所述芯片临时固定体上的热固性树脂片; 以及在90℃下的拉伸储存弹性模量为200MPa以下并且配置在所述热固性树脂片上的隔膜; 所述密封体包括半导体芯片和覆盖半导体芯片的热固性树脂片。

公开(公告)号：US20180304603A1

公开(公告)日：2018-10-25

申请号：US15770567

申请日：2016-10-13

申请人： Nitto Denko Corporation

发明人： Chie Iino ,  Goji Shiga

IPC分类号： B32B27/30 ,  B32B27/08 ,  B32B27/36 ,  H01L23/31 ,  H01L23/00

CPC分类号： B32B27/30 ,  H01L2224/11

摘要： Provided is a bump base reinforcement sheet which can reinforce a base portion of even a solder bump having a large diameter on a primary mounted substrate side and achieve good electrical connection with a secondary mounted substrate. A bump base reinforcement sheet includes: a base material sheet; and a thermosetting resin sheet laminated on the base material sheet, in which a thickness t [μm] of the base material sheet and a minimum melt viscosity η [Pa·s] of the thermosetting resin sheet at 50 to 180° C. satisfy the following relational expression: 150≤t·η≤100000.

公开(公告)号：US09754894B2

公开(公告)日：2017-09-05

申请号：US14908687

申请日：2014-06-30

申请人： NITTO DENKO CORPORATION

发明人： Chie Iino ,  Takeshi Matsumura ,  Goji Shiga ,  Kosuke Morita

IPC分类号： H01L23/28 ,  H01L23/544 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L23/29

CPC分类号： H01L23/544 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/02 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0231 ,  H01L2224/11 ,  H01L2224/83 ,  H01L21/56 ,  H01L2223/544 ,  H01L21/304 ,  H01L21/78 ,  H01L2924/00014

摘要： Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 μm or less before the sheet is cured.

公开(公告)号：US20170032979A1

公开(公告)日：2017-02-02

申请号：US15105909

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16146 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83005

摘要： Provided is a production method for a semiconductor package which can yield a sealed resin body excellent in surface smoothness, and which makes it possible to omit any step of grinding a resin region of the sealed resin body. This method is a production method, for a semiconductor package, including the step of pressurizing a stacked body which includes: a chip-temporarily-fixed body comprising a supporting plate, a temporarily-fixing material stacked over the supporting plate, and a semiconductor chip fixed temporarily over the temporarily-fixing material; a thermosetting resin sheet arranged over the chip-temporarily-fixed body; and a separator having a tensile storage elastic modulus of 200 MPa or more at 90° C. and arranged over the thermosetting resin sheet. In this way, a sealed body is formed which includes the semiconductor chip and the thermosetting resin sheet covering the semiconductor chip.

摘要翻译： 提供一种半导体封装的制造方法，其能够得到表面平滑性优异的密封树脂体，并且能够省略对密封的树脂体的树脂区域的研磨的任何步骤。 该方法是一种用于半导体封装的制造方法，包括对堆叠体进行加压的步骤，该堆叠体包括：芯片临时固定体，包括支撑板，堆叠在支撑板上的临时固定材料，以及半导体芯片 临时固定在临时固定材料上; 布置在所述芯片临时固定体上的热固性树脂片; 以及在90℃下的拉伸储存弹性模量为200MPa以上并且配置在热固性树脂片上的隔膜。 以这种方式，形成包括半导体芯片和覆盖半导体芯片的热固性树脂片的密封体。

公开(公告)号：US20170278716A1

公开(公告)日：2017-09-28

申请号：US15506884

申请日：2015-08-06

申请人： NITTO DENKO CORPORATION

发明人： Chie Iino ,  Goji Shiga ,  Jun Ishii

IPC分类号： H01L21/31 ,  H01L23/00 ,  B32B7/12 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56

CPC分类号： H01L21/31 ,  B32B7/12 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L23/12 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/3511

摘要： In order to provide a sealing sheet capable of preventing same from falling off a suction collet during conveyancing, etc., and whereby semiconductor chips can be suitably buried, the sum α of a thickness t [mm] and a storage elastic modulus G′ [Pa] at 50° C., for this sealing sheet, fulfils 300≦α≦1.5×105.

公开(公告)号：US20170040287A1

公开(公告)日：2017-02-09

申请号：US15107203

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L21/78 ,  B32B37/18 ,  B32B7/10 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B37/06 ,  C08J5/18 ,  B29C65/02

CPC分类号： H01L24/96 ,  B29C65/02 ,  B29K2667/003 ,  B29L2031/3481 ,  B32B3/08 ,  B32B5/18 ,  B32B5/20 ,  B32B7/10 ,  B32B7/12 ,  B32B15/046 ,  B32B15/06 ,  B32B25/08 ,  B32B25/12 ,  B32B27/065 ,  B32B27/08 ,  B32B27/26 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B37/06 ,  B32B37/182 ,  B32B37/185 ,  B32B37/187 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/20 ,  B32B2307/51 ,  B32B2307/536 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/105 ,  B32B2367/00 ,  B32B2457/14 ,  C08J5/18 ,  C08J2363/02 ,  C08J2433/10 ,  C08J2461/06 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/293 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00

摘要： The electronic component device production method includes a step A of preparing a layered body comprising electronic components immobilized on a support body, a step B of preparing an electronic component sealing sheet, a step C of disposing the electronic component sealing sheet over the electronic components under conditions where the probe tack force of the electronic component sealing sheet is 5 gf or lower according to a probe tack test, a step D of rising the temperature of the electronic component sealing sheet until the probe tack of the electronic component sealing sheet is 10 gf or greater according to the probe tack test to immobilize temporarily the electronic component sealing sheet onto the electronic components, and a step E of embedding the electronic components in the electronic component sealing sheet to form a sealed body comprising the electronic components embedded in the electronic component sealing sheet.

摘要翻译： 电子部件装置的制造方法包括：制备包含固定在支撑体上的电子部件的层叠体的工序A，制备电子部件密封片的工序B，将电子部件密封片设置在电子部件下方的工序C 根据探针粘着试验，电子部件密封片的探针粘着力为5gf以下的条件，电子部件密封片的温度上升到电子部件密封片的探针粘着前的步骤D为10gf 或更大，以将电子部件密封片暂时固定在电子部件上，以及将电子部件嵌入电子部件密封片中的步骤E，形成包含嵌入电子部件的电子部件的密封体 密封片。

公开(公告)号：US20160300733A1

公开(公告)日：2016-10-13

申请号：US15037794

申请日：2014-10-31

申请人： NITTO DENKO CORPORATION

发明人： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/568 ,  C09J7/10 ,  C09J7/40 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

摘要： A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 μm or more, and a separator (B) stacked on the other surface of the sealing sheet.

摘要翻译： 在两面上具有隔膜的密封片设置有密封片，层叠在密封片的一个表面上且厚度为50μm以上的隔膜（A）和层叠在另一个表面上的隔膜（B） 密封片。

公开(公告)号：US10128131B2

公开(公告)日：2018-11-13

申请号：US15037794

申请日：2014-10-31

申请人： Nitto Denko Corporation

发明人： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  C09J7/40 ,  C09J7/10

摘要： A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 μm or more, and a separator (B) stacked on the other surface of the sealing sheet.

公开(公告)号：US10074582B2

公开(公告)日：2018-09-11

申请号：US15507923

申请日：2015-08-21

申请人： NITTO DENKO CORPORATION

发明人： Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L23/10 ,  H01L23/31 ,  C09J7/02

CPC分类号： H01L23/3142 ,  C09J7/22 ,  C09J7/30 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/0002 ,  H01L2924/18162

摘要： Provided is a sealing sheet capable of preventing void and filler segregation from occurring when forming a sealing body in which semiconductor chips are buried in the sealing sheet. The sealing sheet has a viscosity within the range of 1 Pa·s to 50000 Pa·s at 90° C.

公开(公告)号：US20170125373A1

公开(公告)日：2017-05-04

申请号：US15107222

申请日：2014-12-22

申请人： NITTO DENKO CORPORATION

发明人： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Jun Ishii ,  Goji Shiga ,  Chie Iino

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L21/56

CPC分类号： H01L24/96 ,  G03F7/038 ,  G03F7/0387 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/12 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

摘要： Provided is a method for producing a semiconductor package. By this method, a periphery of a light-exposure planning region can be prevented from being exposed to light. The method is a semiconductor package producing method in which a film-formation planning surface of a cured product has a surface roughness of a predetermined value or less.