Invention Application
US20170047400A1 INTEGRATION METHODS TO FABRICATE INTERNAL SPACERS FOR NANOWIRE DEVICES
审中-公开
用于制造纳米器件的内部间隔件的集成方法
- Patent Title: INTEGRATION METHODS TO FABRICATE INTERNAL SPACERS FOR NANOWIRE DEVICES
- Patent Title (中): 用于制造纳米器件的内部间隔件的集成方法
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Application No.: US15333123Application Date: 2016-10-24
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Publication No.: US20170047400A1Publication Date: 2017-02-16
- Inventor: Seiyon Kim , Kelin J. KUHN , Tahir GHAN! , Anand S. MURTHY , Mark ARMSTRONG , Rafael RIOS , Abhijit Jayant PETHE , Willy RACHMADY
- Applicant: Intel Corporation
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/3105 ; H01L21/306 ; H01L21/3115 ; H01L29/66 ; H01L29/08

Abstract:
A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.
Public/Granted literature
- US09859368B2 Integration methods to fabricate internal spacers for nanowire devices Public/Granted day:2018-01-02
Information query
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