Invention Application
US20170059648A1 SEMICONDUCTOR APPARATUS, STACK SEMICONDUCTOR APPARATUS, AND TEST METHOD OF THE STACK SEMICONDUCTOR APPARATUS
审中-公开
半导体器件，堆叠半导体器件和堆叠半导体器件的测试方法
- Patent Title: SEMICONDUCTOR APPARATUS, STACK SEMICONDUCTOR APPARATUS, AND TEST METHOD OF THE STACK SEMICONDUCTOR APPARATUS
- Patent Title (中): 半导体器件，堆叠半导体器件和堆叠半导体器件的测试方法
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Application No.: US15207526Application Date: 2016-07-12
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Publication No.: US20170059648A1Publication Date: 2017-03-02
- Inventor: Seung-han WOO , Reum OH , Hae-suk LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2015-0123188 20150831
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L23/48 ; H01L25/065 ; H01L21/66
Abstract:
A semiconductor apparatus includes two or more semiconductor chips and a tester. The two or more semiconductor chips are electrically connected through one or more through-silicon vias (TSVs). The tester is on at least one of the two or more semiconductor chips and tests the state of at least one TSV based on an output signal of the TSV. The TSV is selected as a signal transmission TSV based on the state of the TSV.
Public/Granted literature
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