公开(公告)号：US20170059648A1

公开(公告)日：2017-03-02

申请号：US15207526

申请日：2016-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-han WOO ,  Reum OH ,  Hae-suk LEE

IPC: G01R31/28 ,  H01L23/48 ,  H01L25/065 ,  H01L21/66

CPC classification number: G01R31/2884 ,  G01R31/2853 ,  G01R31/2856 ,  G01R31/318513 ,  H01L22/34 ,  H01L23/481 ,  H01L25/0657 ,  H01L2225/06541

Abstract: A semiconductor apparatus includes two or more semiconductor chips and a tester. The two or more semiconductor chips are electrically connected through one or more through-silicon vias (TSVs). The tester is on at least one of the two or more semiconductor chips and tests the state of at least one TSV based on an output signal of the TSV. The TSV is selected as a signal transmission TSV based on the state of the TSV.

Abstract translation: 半导体装置包括两个或更多个半导体芯片和测试器。 两个或多个半导体芯片通过一个或多个穿硅通孔（TSV）电连接。 测试仪在两个或多个半导体芯片中的至少一个上，并且基于TSV的输出信号测试至少一个TSV的状态。 基于TSV的状态选择TSV作为信号传输TSV。