Invention Application
- Patent Title: METHOD FOR TREATING SUBSTRATE
- Patent Title (中): 处理基板的方法
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Application No.: US15176972Application Date: 2016-06-08
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Publication No.: US20170069485A1Publication Date: 2017-03-09
- Inventor: Jihoon JEONG , Jung-Min OH , Kuntack LEE , Hyosan LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0125595 20150904
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/311
Abstract:
In embodiment, the method includes cleaning a preceding substrate, and drying the preceding substrate and cleaning a next substrate. Drying the preceding substrate and cleaning the next substrate include determining a cleaning start time of the next substrate, and the cleaning start time corresponds to a desired time point after starting drying the preceding substrate.
Public/Granted literature
- US09831081B2 Method for treating substrate Public/Granted day:2017-11-28
Information query
IPC分类:
