Invention Application
- Patent Title: DATA COMPRESSION FOR EBEAM THROUGHPUT
- Patent Title (中): EBEAM THROUGHPUT数据压缩
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Application No.: US15122398Application Date: 2014-12-19
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Publication No.: US20170069509A1Publication Date: 2017-03-09
- Inventor: Donald W. NELSON , Yan A. BORODOVSKY , Mark C. PHILLIPS , Robert M. BIGWOOD
- Applicant: Intel Corporation
- International Application: PCT/US2014/071650 WO 20141219
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01J37/317 ; H01J37/04 ; H01L21/027 ; H01J37/302
Abstract:
Lithographic apparatuses suitable for, and methodologies involving, complementary e-beam lithography (CEBL) are described. In an example, a method of data compression or data reduction for e-beam tool simplification involves providing an amount of data to write a column field and to adjust the column field for field edge placement error on a wafer, wherein the amount of data is limited to data for patterning approximately 10% or less of the column field. The method also involves performing e-beam writing on the wafer using the amount of data.
Information query
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