Invention Application
US20170069753A1 INTEGRATED CIRCUITS HAVING TUNNEL TRANSISTORS AND METHODS FOR FABRICATING THE SAME
审中-公开
具有隧道式晶体管的集成电路及其制造方法
- Patent Title: INTEGRATED CIRCUITS HAVING TUNNEL TRANSISTORS AND METHODS FOR FABRICATING THE SAME
- Patent Title (中): 具有隧道式晶体管的集成电路及其制造方法
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Application No.: US14844522Application Date: 2015-09-03
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Publication No.: US20170069753A1Publication Date: 2017-03-09
- Inventor: Eng Huat Toh , Kiok Boone Elgin Quek
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/283 ; H01L21/02 ; H01L21/306 ; H01L29/08 ; H01L29/06 ; H01L29/10 ; H01L29/36 ; H01L29/66 ; H01L29/423

Abstract:
Integrated circuits including tunnel transistors and methods for fabricating such integrated circuits are provided. An exemplary method for fabricating an integrated device includes forming a lower source/drain region in and/or over a semiconductor substrate. The method forms a channel region overlying the lower source/drain region. The method also forms an upper source/drain region overlying the channel region. The method includes forming a gate structure beside the channel region.
Public/Granted literature
- US10211338B2 Integrated circuits having tunnel transistors and methods for fabricating the same Public/Granted day:2019-02-19
Information query
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