Invention Application
- Patent Title: LIGHT-EMITTING DIODE PACKAGE
- Patent Title (中): 发光二极管封装
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Application No.: US15227067Application Date: 2016-08-03
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Publication No.: US20170069809A1Publication Date: 2017-03-09
- Inventor: Jo-Shung Chen , Chih-Hao Lin , Tzong-Liang Tsai
- Applicant: Lextar Electronics Corporation
- Priority: TW104129508 20150907
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/50 ; H01L33/60
Abstract:
A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.
Information query
IPC分类:
