公开(公告)号：US11588078B2

公开(公告)日：2023-02-21

申请号：US16931463

申请日：2020-07-17

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi Kuo ,  Jian-Chin Liang ,  Yu-Chun Lee ,  Fu-Hsin Chen ,  Chih-Hao Lin

IPC: H01L33/50 ,  H01L33/22 ,  H01L33/48 ,  H01L33/62 ,  H01L27/15

Abstract: A light emitting device includes an LED die and a wavelength conversion layer. The LED die has a light emitting top surface and light emitting side surfaces. The wavelength conversion layer contains quantum dots and a photosensitive material, and is located on the light emitting top surface. A light emitting module including multiple light emitting devices is also disclosed.

公开(公告)号：US11296269B2

公开(公告)日：2022-04-05

申请号：US16944131

申请日：2020-07-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US10386629B2

公开(公告)日：2019-08-20

申请号：US15729649

申请日：2017-10-10

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Hui-Ru Wu ,  Jo-Hsiang Chen ,  Tzong-Liang Tsai

IPC: F21V9/30 ,  G02B5/26 ,  G02B5/28 ,  G02B26/00 ,  F21Y115/10

Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 μm.

公开(公告)号：US11664483B2

公开(公告)日：2023-05-30

申请号：US17078098

申请日：2020-10-23

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi Kuo ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Chih-Hao Lin

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/50 ,  H01L33/38 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.

公开(公告)号：US11610875B2

公开(公告)日：2023-03-21

申请号：US17100933

申请日：2020-11-22

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jian-Chin Liang ,  Chien-Nan Yeh ,  Shih-Lun Lai ,  Jo-Hsiang Chen

IPC: H01L29/205 ,  H01L33/00 ,  H01L25/16 ,  H01L33/62 ,  H01L33/60

Abstract: Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first signal wires, a plurality of second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

公开(公告)号：US11373589B1

公开(公告)日：2022-06-28

申请号：US17444671

申请日：2021-08-09

Applicant: Lextar Electronics Corporation

Inventor： Chien-Nan Yeh ,  Chih-Hao Lin ,  Cheng-Te Lin ,  Ku-Cheng Lin

IPC: G09G3/32

Abstract: A display includes first and second pixel devices. The first pixel device includes a first control circuit and a first light emitting circuit. The first control circuit generates a first light emitting signal according to a first clock signal and a data signal during a first period. The first light emitting circuit emits light according to the first light emitting signal during second and third periods. The second pixel device includes a second control circuit and a second light emitting circuit. The second control circuit generates a second light emitting signal according to a second clock signal and the data signal during the second period. The second light emitting circuit is coupled to the second control circuit and emits light according to the second light emitting signal during the third period. The first period to the third period are arranged continuously in order.

公开(公告)号：US20170358709A1

公开(公告)日：2017-12-14

申请号：US15618190

申请日：2017-06-09

Applicant: Lextar Electronics Corporation

Inventor： Che-Hsuan Huang ,  Shu-Hsiu Chang ,  Hsin-Lun Su ,  Chih-Hao Lin ,  Tzong-Liang Tsai

IPC: H01L33/20 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L27/15

CPC classification number: H01L33/20 ,  H01L27/156 ,  H01L33/50 ,  H01L33/502 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light emitting diode chip scale packaging structure is disclosed. The light emitting diode chip scale packaging structure comprises a light emitting diode chip and a lens. The lens covers the light emitting diode chip. A curve of an outer surface of the lens in a cross-section view substantially complies with a polynomial of: z=Σi=0nai*yi, A center point of the curve corresponding to the light emitting diode chip is a zero point of y-z coordinate axes. z is a variable of vertical axis of the curve. y is a variable of horizontal axis of the curve. ai is a constant coefficient in a term of ith degree. 3

公开(公告)号：US11961951B2

公开(公告)日：2024-04-16

申请号：US17383402

申请日：2021-07-22

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jian-Chin Liang ,  Shih-Lun Lai ,  Jo-Hsiang Chen

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/165 ,  H01L25/167 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

公开(公告)号：US11670749B2

公开(公告)日：2023-06-06

申请号：US17653462

申请日：2022-03-03

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US11552222B2

公开(公告)日：2023-01-10

申请号：US16879787

申请日：2020-05-21

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Hui-Ru Wu ,  Jo-Hsiang Chen ,  Jian-Chin Liang ,  Ai-Sen Liu

IPC: H01L33/50 ,  H01L33/60 ,  H01L25/075

Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.