Invention Application
US20170077002A1 SYSTEM TO DETECT WAFER ARCING IN SEMICONDUCTOR MANUFACTURING EQUIPMENT
审中-公开
在半导体制造设备中检测波纹的系统
- Patent Title: SYSTEM TO DETECT WAFER ARCING IN SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Patent Title (中): 在半导体制造设备中检测波纹的系统
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Application No.: US15362706Application Date: 2016-11-28
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Publication No.: US20170077002A1Publication Date: 2017-03-16
- Inventor: Scott Singlevich , Kommisetti Subrahmanyam , Tony Davis , Michael Johnson
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01J37/32 ; G01R31/02 ; H01L21/67
Abstract:
Methods and systems for accurate arc detection in semiconductor manufacturing tools are disclosed. Such methods and systems provide real-time arc detection and near real-time notification for corrective actions during a semiconductor manufacturing process. Such methods and systems utilize data with high sample rate and wavelet analysis to provide for more accurate arc detection, which leads to more effective and cost efficient semiconductor manufacturing operations.
Public/Granted literature
- US10283421B2 System to detect wafer arcing in semiconductor manufacturing equipment Public/Granted day:2019-05-07
Information query
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