Invention Application
- Patent Title: METHOD AND APPARATUS FOR SOURCE-DRAIN JUNCTION FORMATION IN A FINFET WITH IN-SITU DOPING
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Application No.: US15385811Application Date: 2016-12-20
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Publication No.: US20170104088A1Publication Date: 2017-04-13
- Inventor: Vladimir MACHKAOUTSAN , Jeffrey Junhao XU , Stanley Seungchul SONG , Mustafa BADAROGLU , Choh Fei YEAP
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/165 ; H01L21/225

Abstract:
A portion of a bulk silicon (Si) is formed into a fin, having a fin base and, on the fin base, an in-process fin. The fin base is doped Si and the in-process fin is silicon germanium (SiGe). The in-process SiGe fin has a source region and a drain region. Boron is in-situ doped into the drain region and into the source region. Optionally, boron is in-situ doped by forming an epi-layer, having boron, on the drain region and on the source region, and drive-in annealing to diffuse boron in the source region and the drain region.
Information query
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