Invention Application
- Patent Title: SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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Application No.: US15128127Application Date: 2015-03-23
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Publication No.: US20170110341A1Publication Date: 2017-04-20
- Inventor: Kenji ONODA , Eiji NOMURA , Tooru OOTANI , Akinori ODA
- Applicant: DENSO CORPORATION
- Priority: JP2014-064194 20140326
- International Application: PCT/JP2015/001623 WO 20150323
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56
Abstract:
A pressing unit including a pressing pin is attached to a mold, a semiconductor chip, first and second heat sinks, and solders are disposed in a cavity of the mold, a mold closing state is made, and a reflow is carried out in a state where the first and second heat sinks are pressed against first and second wall surfaces by the pressing pin to form a laminated body. After the laminated body is formed, the pressing pin is pulled out from the cavity, and a resin molded body is formed by injecting a resin.
Information query
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