公开(公告)号：US20170110341A1

公开(公告)日：2017-04-20

申请号：US15128127

申请日：2015-03-23

Applicant: DENSO CORPORATION

Inventor： Kenji ONODA ,  Eiji NOMURA ,  Tooru OOTANI ,  Akinori ODA

IPC: H01L21/48 ,  H01L21/56

CPC classification number: H01L21/4882 ,  H01L21/56 ,  H01L21/565 ,  H01L23/051 ,  H01L23/3107 ,  H01L24/33 ,  H01L25/07 ,  H01L25/18 ,  H01L2021/60015 ,  H01L2021/603 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A pressing unit including a pressing pin is attached to a mold, a semiconductor chip, first and second heat sinks, and solders are disposed in a cavity of the mold, a mold closing state is made, and a reflow is carried out in a state where the first and second heat sinks are pressed against first and second wall surfaces by the pressing pin to form a laminated body. After the laminated body is formed, the pressing pin is pulled out from the cavity, and a resin molded body is formed by injecting a resin.

公开(公告)号：US20140015120A1

公开(公告)日：2014-01-16

申请号：US14024917

申请日：2013-09-12

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract translation: 半导体器件包括封装和冷却器。 半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。 金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。 导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。 冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。 导电层和冷却器电连接在一起。

公开(公告)号：US20140203426A1

公开(公告)日：2014-07-24

申请号：US14220277

申请日：2014-03-20

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

公开(公告)号：US20170278774A1

公开(公告)日：2017-09-28

申请号：US15508506

申请日：2015-12-04

Applicant: DENSO CORPORATION

Inventor： Eiji HAYASHI ,  Wataru KOBAYASHI ,  Eiji NOMURA ,  Kazuki KOUDA

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/29 ,  H01L21/48

CPC classification number: H01L23/4952 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/488 ,  H01L23/49527 ,  H01L23/49562 ,  H01L23/49575 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/33 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.

公开(公告)号：US20140361425A1

公开(公告)日：2014-12-11

申请号：US14469698

申请日：2014-08-27

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/427 ,  H01L23/367

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.