公开(公告)号：US20170110341A1

公开(公告)日：2017-04-20

申请号：US15128127

申请日：2015-03-23

Applicant: DENSO CORPORATION

Inventor： Kenji ONODA ,  Eiji NOMURA ,  Tooru OOTANI ,  Akinori ODA

IPC: H01L21/48 ,  H01L21/56

CPC classification number: H01L21/4882 ,  H01L21/56 ,  H01L21/565 ,  H01L23/051 ,  H01L23/3107 ,  H01L24/33 ,  H01L25/07 ,  H01L25/18 ,  H01L2021/60015 ,  H01L2021/603 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A pressing unit including a pressing pin is attached to a mold, a semiconductor chip, first and second heat sinks, and solders are disposed in a cavity of the mold, a mold closing state is made, and a reflow is carried out in a state where the first and second heat sinks are pressed against first and second wall surfaces by the pressing pin to form a laminated body. After the laminated body is formed, the pressing pin is pulled out from the cavity, and a resin molded body is formed by injecting a resin.