Invention Application
- Patent Title: Method and Apparatus for Use in Wafer Processing
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Application No.: US14933931Application Date: 2015-11-05
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Publication No.: US20170133253A1Publication Date: 2017-05-11
- Inventor: Thomas Fischer , Gerald Lackner , Walter Horst Leitgeb , Michael Lecher
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01B11/27 ; H01L21/68 ; H01L21/66 ; H01L21/78
Abstract:
A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.
Public/Granted literature
- US10186438B2 Method and apparatus for use in wafer processing Public/Granted day:2019-01-22
Information query
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