公开(公告)号：US11637028B2

公开(公告)日：2023-04-25

申请号：US17219351

申请日：2021-03-31

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

Abstract: In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.

公开(公告)号：US12148640B2

公开(公告)日：2024-11-19

申请号：US18160124

申请日：2023-01-26

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/66 ,  H01L21/68 ,  H01L21/78

Abstract: In an embodiment a method includes placing a wafer on a receptacle comprising a chuck base, wherein a light port for emitting light from a source of light is an opening located in a surface of the chuck base, and wherein the light port is located underneath the wafer, shining the light from the light port at an edge of the wafer so that light passes by the edge of the wafer and processing the wafer on the receptacle based on the light that passed by the edge of the wafer and that is received by a light sensitive element.

公开(公告)号：US20210217640A1

公开(公告)日：2021-07-15

申请号：US17219351

申请日：2021-03-31

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/78 ,  H01L21/66 ,  H01L21/68

Abstract: In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.

公开(公告)号：US10985041B2

公开(公告)日：2021-04-20

申请号：US16220888

申请日：2018-12-14

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

公开(公告)号：US20170133253A1

公开(公告)日：2017-05-11

申请号：US14933931

申请日：2015-11-05

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/66 ,  H01L21/78

CPC classification number: H01L21/67259 ,  G01B11/272 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/78 ,  H01L22/20

Abstract: A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.

公开(公告)号：US20230170233A1

公开(公告)日：2023-06-01

申请号：US18160124

申请日：2023-01-26

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

CPC classification number: H01L21/67259 ,  G01B11/272 ,  H01L21/681 ,  H01L21/78 ,  H01L22/20 ,  H01L21/67092

Abstract: In an embodiment a method includes placing a wafer on a receptacle comprising a chuck base, wherein a light port for emitting light from a source of light is an opening located in a surface of the chuck base, and wherein the light port is located underneath the wafer, shining the light from the light port at an edge of the wafer so that light passes by the edge of the wafer and processing the wafer on the receptacle based on the light that passed by the edge of the wafer and that is received by a light sensitive element.

公开(公告)号：US20190122909A1

公开(公告)日：2019-04-25

申请号：US16220888

申请日：2018-12-14

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  H01L21/78 ,  H01L21/66 ,  G01B11/27 ,  H01L21/68

Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

公开(公告)号：US10186438B2

公开(公告)日：2019-01-22

申请号：US14933931

申请日：2015-11-05

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

Abstract: A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.