- 专利标题: Organosilicon modified photoinitiator and a photo-curable adhesive composition comprising the same
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申请号: US15443476申请日: 2017-02-27
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公开(公告)号: US20170166594A1公开(公告)日: 2017-06-15
- 发明人: Hao Wu , Zhiming Li , Jinyou Li , Yong Zhang , Xingang Zhang , Zhixiang Lu , Zheng Lu
- 申请人: Henkel AG & Co. KGaA , Henkel IP & Holding GmbH
- 主分类号: C07F7/18
- IPC分类号: C07F7/18 ; C08J3/28 ; C09J133/14 ; C08F120/68
摘要:
The present document discloses an organosilicon modified photoinitiator represented by the general formula (I): wherein, R1 and R2 are each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl C1-C3 alkyl; one of R3, R4, R5, R6, and R7 is SIL1-X, and the others are each independently selected from the group consisting of hydrogen, C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl C1-C3 alkyl, and halogen; X is a direct bond or C1-C12 alkylene; and SIL1 and SIL2 are each independently represented by the formula —SiR8R9R10 or (R′SiO3/2)a(R″2SiO2/2)b(R′″3SiO1/2)c, wherein R8, R9 and R10 are each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl, and aryl C1-C3 alkyl, R′, R″ and R′″ each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, and phenyl C1-C3 alkyl, and a, b, and c are numbers that satisfy a≧0, b≧0, c>0, the ratio of a to c is from 0 to 100, and the ratio of b to c is from 0 to 10.
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