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1.发明申请公开(公告)号：US20170166594A1
公开(公告)日：2017-06-15
申请号：US15443476
申请日：2017-02-27
发明人： Hao Wu , Zhiming Li , Jinyou Li , Yong Zhang , Xingang Zhang , Zhixiang Lu , Zheng Lu
IPC分类号： C07F7/18 , C08J3/28 , C09J133/14 , C08F120/68
CPC分类号： C07F7/1804 , C07F7/18 , C08F2/46 , C08F2/50 , C08F120/68 , C08G77/14 , C08J3/28 , C08J2333/14 , C08L83/04 , C08L83/06 , C09J133/14 , C09J2205/114 , C09J2433/00 , C08L83/00
摘要： The present document discloses an organosilicon modified photoinitiator represented by the general formula (I): wherein, R1 and R2 are each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl C1-C3 alkyl; one of R3, R4, R5, R6, and R7 is SIL1-X, and the others are each independently selected from the group consisting of hydrogen, C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl C1-C3 alkyl, and halogen; X is a direct bond or C1-C12 alkylene; and SIL1 and SIL2 are each independently represented by the formula —SiR8R9R10 or (R′SiO3/2)a(R″2SiO2/2)b(R′″3SiO1/2)c, wherein R8, R9 and R10 are each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl, and aryl C1-C3 alkyl, R′, R″ and R′″ each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, and phenyl C1-C3 alkyl, and a, b, and c are numbers that satisfy a≧0, b≧0, c>0, the ratio of a to c is from 0 to 100, and the ratio of b to c is from 0 to 10.
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公开(公告)号：US10597413B2
公开(公告)日：2020-03-24
申请号：US16031023
申请日：2018-07-10
发明人： Wenjuan Tan , Zhixiang Lu , Hao Wu , Yong Zhang , Zheng Lu , Xuelong Hou
摘要： Certain phosphonate compounds useful as photoinitiators are provided herein.
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3.发明授权公开(公告)号：US10189867B2
公开(公告)日：2019-01-29
申请号：US15443476
申请日：2017-02-27
发明人： Hao Wu , Zhiming Li , Jinyou Li , Yong Zhang , Xingang Zhang , Zhixiang Lu , Zheng Lu
IPC分类号： C07F7/18 , C08F4/16 , C08F2/50 , C08F2/46 , C08L83/04 , C08L83/06 , C08F120/68 , C08J3/28 , C09J133/14 , C08G77/14
摘要： The present document discloses an organosilicon modified photoinitiator represented by the general formula (I): wherein, R1 and R2 are each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl C1-C3 alkyl; one of R3, R4, R5, R6, and R7 is SIL1-X, and the others are each independently selected from the group consisting of hydrogen, C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl C1-C3 alkyl, and halogen; X is a direct bond or C1-C12 alkylene; and SIL1 and SIL2 are each independently represented by the formula —SiR8R9R10 or (R′SiO3/2)a(R″2SiO2/2)b(R′″3SiO1/2)c, wherein R8, R9 and R10 are each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, aryl, and aryl C1-C3 alkyl, R′, R″ and R′″ each independently selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, and phenyl C1-C3 alkyl, and a, b, and c are numbers that satisfy a≥0, b≥0, c>0, the ratio of a to c is from 0 to 100, and the ratio of b to c is from 0 to 10.
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公开(公告)号：US20180312532A1
公开(公告)日：2018-11-01
申请号：US16031023
申请日：2018-07-10
发明人： Wenjuan TAN , Zhixiang Lu , Hao Wu , Yong Zhang , Zheng Lu , Xuelong Hou
CPC分类号： C07F9/5337 , C07F9/3252 , C08F2/50 , C08G77/08
摘要： Compounds represented by the following Formula I: wherein: R1, R2, R3, R4, and R5 are the same or different and are selected from the group consisting of SIL1-X, hydrogen, C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, phenyl C1-C3 alkyl, and fluorine; X is optional, and if present is C1-C12 alkyl; SIL1 has the general formula: (R7SiO3/2)a(R72SiO2/2)b(R73SiO1/2)c wherein: R7 is selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, alkoxyl, phenyl, and phenyl C1-C3 alkyl; a is a positive number, b is 0 or a positive number, c is 0 or a positive number, b/a is from 0 to 100, and c/a is from 0 to 10, wherein at least one of R1, R2, R3, R4, and R5 is SIL1-X; and R6 is selected from the group consisting of C1-C20 alkyl, C2-C8 alkenyl, C5-C8 cycloalkyl, phenyl, phenyl C1-C3 alkyl, trimethylphenol, and fluorine, a method to produce these compounds, and the use thereof as a photoinitiator.
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公开(公告)号：US20210139751A1
公开(公告)日：2021-05-13
申请号：US17149832
申请日：2021-01-15
申请人： Henkel AG & Co. KGaA
发明人： ChunYu Sun , JinQian Chen , Yang Yuheng , Cheng Lu , Xueyu Shawn Qiu , Hao Wu
IPC分类号： C09J11/06 , C09J11/04 , C08F220/06 , C08F220/14 , C08F220/18 , C08F220/56 , C08F136/06 , C08L53/00 , C08L9/02 , C08K3/22 , C08K3/36 , C08K5/00 , C08K5/50 , C08K5/5313
摘要： This invention relates to adhesive compositions and more particularly to (meth)acrylic adhesive compositions for electrical device such as with improved bonding strength, thermal conductivity as well as flame retardancy.
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公开(公告)号：US20220002607A1
公开(公告)日：2022-01-06
申请号：US17475548
申请日：2021-09-15
申请人： Henkel AG & Co. KGaA
摘要： This invention relates to a thermally conductive potting composition, comprising a first part comprising at least one epoxy resin; at least one thermally conductive filler; and at least one metal complex; and a second part comprising at least one curing agent. The first part of the thermally conductive potting composition exhibits high thixotropic index and therefore the first part is easily stored. After the first part and the second part is mixed, the thermally conductive potting composition exhibits low thixotropic index and the meets the requirement for potting process.
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公开(公告)号：US20210238408A1
公开(公告)日：2021-08-05
申请号：US17239789
申请日：2021-04-26
申请人： Henkel AG & Co. KGaA
摘要： This invention relates to a thermal conductive potting composition. In particular, the present invention relates to a thermal conductive potting composition having a low viscosity, a high thermal conductivity, a high toughness and excellent thermal shock performance for new energy vehicles.
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公开(公告)号：US20230058263A1
公开(公告)日：2023-02-23
申请号：US17967249
申请日：2022-10-17
申请人： Henkel AG & Co. KGaA
发明人： Zhenfeng Cao , Hao Wu , Xueyu Qiu
IPC分类号： C08L63/00 , C09J163/00
摘要： The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.
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公开(公告)号：US20220025181A1
公开(公告)日：2022-01-27
申请号：US17496895
申请日：2021-10-08
申请人： Henkel AG & Co. KGaA
发明人： Wentao Xing , Yizhen Wang , Hao Wu , Xueyu Qiu , Xinyu Zhang , Xingyu Zhu
摘要： The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm. The present invention also provides a thermal potting adhesive containing the thermally conductive silicone potting composition, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component, which is potted using the thermally conductive silicone potting composition.
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10.发明授权公开(公告)号：US09994681B2
公开(公告)日：2018-06-12
申请号：US15647648
申请日：2017-07-12
申请人： Henkel AG & Co. KGaA
发明人： Hao Wu , Wenjuan Tan , Wentao Xing , Yong Zhang , Mieko Sano , Aya Hikita , Tadashi Takano , Liwei Zhang , Carol Yang , Zhiming Li , Juan Du
IPC分类号： C08G77/20 , C08G77/12 , C08K5/3477 , C08G77/08
CPC分类号： C08G77/20 , C08G77/08 , C08G77/12 , C08G77/388 , C08K5/3477 , C08L83/04 , C08L83/08 , H01L33/56 , C08K5/34924 , C08K5/56 , C08L83/00
摘要： The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.
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