Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
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Application No.: US14970444Application Date: 2015-12-15
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Publication No.: US20170170146A1Publication Date: 2017-06-15
- Inventor: Chih-Ming SHEN , Shih-Hsien WU , Ming-Ji DAI
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/498 ; H01L21/768 ; H01L21/683 ; H01L21/56
Abstract:
A semiconductor device is provided. The semiconductor device includes at least one first die, a rib structure enclosing the at least one first die, and a molding layer covering the at least one first die. The rib structure is formed of a first material and the molding layer is formed of a second material. A Young's modulus of the first material is larger than a Young's modulus of the second material.
Information query
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