Invention Application
- Patent Title: CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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Application No.: US15058138Application Date: 2016-03-01
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Publication No.: US20170196095A1Publication Date: 2017-07-06
- Inventor: Hung-Lin Chang , Chen-Wei Tseng
- Applicant: Unimicron Technology Corp.
- Priority: TW105100300 20160106
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/09 ; H05K1/02
Abstract:
A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. The build-up circuit structure is disposed on the core layer and covers the metal contraposition component by using a position of the metal contraposition component as a fiducial mark.
Information query
