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    WIRING BOARD STRUCTURE
    1.
    发明申请
    WIRING BOARD STRUCTURE 审中-公开
    接线板结构

    公开(公告)号：US20150053462A1

    公开(公告)日：2015-02-26

    申请号：US14062912

    申请日：2013-10-25

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Wei-Ming Cheng ,  Hung-Lin Chang

    IPC: H05K1/02

    CPC classification number: H05K1/0206 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73259 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/16 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/09527 ,  H05K2201/10219

    Abstract: A wiring board structure adapted to carry a heat generating component is provided. The wiring board structure includes a core layer, an active cooler, a dielectric layer and a plurality of conductive vias. The core layer has a cavity penetrating through the core layer. The active cooler includes a cold surface and a hot surface. The active cooler is disposed in the cavity. The dielectric layer covers the core layer and fills a gap between the active cooler and the cavity. The heat-generating component is disposed on an outer surface of the dielectric layer. The conductive vias are disposed in the dielectric layer and connecting the cold surface and the outer surface to connect the heat-generating component and the active cooler. A wiring board structure having an active cooling via is also provided.

    Abstract translation: 提供适于承载发热部件的布线板结构。 布线板结构包括芯层，有源冷却器，电介质层和多个导电通孔。 芯层具有穿透芯层的腔体。 主动冷却器包括冷表面和热表面。 有源冷却器设置在空腔中。 电介质层覆盖芯层并填充主动式冷却器和空腔之间的间隙。 发热部件设置在电介质层的外表面上。 导电通孔设置在电介质层中，并连接冷表面和外表面，以连接发热部件和主动冷却器。 还提供了具有主动冷却通路的布线板结构。

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    包装结构及其制造方法

    公开(公告)号：US20170055349A1

    公开(公告)日：2017-02-23

    申请号：US14833129

    申请日：2015-08-23

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ta-Han Lin

    IPC: H05K1/18 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/186 ,  H01L23/3121 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2924/15153 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/0346 ,  H05K1/111 ,  H05K1/115 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/09081 ,  H05K2201/09545

    Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.

    Abstract translation: 封装结构包括电路基板，至少一个电子部件和连接槽。 电路基板包括至少一个芯层，包括至少三个图案化电路层，至少两个介电层和导电通孔以及电路板的堆积结构。 电子部件嵌入在至少一个电介质层中并且位于配置区域中。 电子部件通过导电通孔的一部分电连接到图案化电路层之一。 连接槽具有底部，连接底部的多个侧壁部分和位于侧壁部分上的多个连接垫。 电路基板组装到底部，并且电路板通过相对于配置区域弯曲的芯层的弯曲区域电连接到连接焊盘。

    Manufacturing method of circuit structure
    4.
    发明授权
    Manufacturing method of circuit structure 有权

    公开(公告)号：US10314179B2

    公开(公告)日：2019-06-04

    申请号：US16013956

    申请日：2018-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K3/46

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    MANUFACTURING METHOD OF CIRCUIT STRUCTURE
    5.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT STRUCTURE 审中-公开

    公开(公告)号：US20180302992A1

    公开(公告)日：2018-10-18

    申请号：US16013956

    申请日：2018-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K3/46

    CPC classification number: H05K3/4697 ,  H05K3/4644

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    Circuit structure and manufacturing method thereof
    6.
    发明授权
    Circuit structure and manufacturing method thereof 有权

    公开(公告)号：US10051748B2

    公开(公告)日：2018-08-14

    申请号：US14997583

    申请日：2016-01-18

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K1/09 ,  H05K3/46

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

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