公开(公告)号：US20170196095A1

公开(公告)日：2017-07-06

申请号：US15058138

申请日：2016-03-01

Applicant: Unimicron Technology Corp.

Inventor： Hung-Lin Chang ,  Chen-Wei Tseng

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K3/4679 ,  H05K1/0266 ,  H05K2201/083 ,  H05K2201/09936

Abstract: A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. The build-up circuit structure is disposed on the core layer and covers the metal contraposition component by using a position of the metal contraposition component as a fiducial mark.

公开(公告)号：US20190067543A1

公开(公告)日：2019-02-28

申请号：US15826702

申请日：2017-11-30

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/62

Abstract: A heat dissipation substrate structure includes a multilayer circuit board including a core board and build-up boards, a heat conduction layer, a cavity structure, bonding pads, and vias. The heat conduction layer is disposed within the core board, or on a surface of the core board, or on a surface of one of the build-up boards. The cavity structure is in the multilayer circuit board with respect to the heat conduction layer and exposes a first surface of the heat conduction layer. The bonding pads are on the surface of the multilayer circuit board at a side of a second surface of the heat conduction layer. The portions of the vias are connected to portions of the bonding pads and the heat conduction layer. Accordingly, heat flow can be distributed via a heat dissipation path from the bonding pads through the vias to the heat conduction layer.

公开(公告)号：US20180368263A1

公开(公告)日：2018-12-20

申请号：US15622078

申请日：2017-06-14

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li ,  Chien-Tsai Li

IPC: H05K1/18 ,  H05K1/11

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

公开(公告)号：US10159151B1

公开(公告)日：2018-12-18

申请号：US15622078

申请日：2017-06-14

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li ,  Chien-Tsai Li

IPC: H05K1/18 ,  H05K1/11

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

公开(公告)号：US10056356B1

公开(公告)日：2018-08-21

申请号：US15585166

申请日：2017-05-03

Applicant: Unimicron Technology Corp.

Inventor： Wen-Fang Liu ,  Shao-Chien Lee ,  Chen-Wei Tseng ,  Zong-Hua Li

IPC: H01L25/075 ,  H01L23/498

CPC classification number: H01L25/0753 ,  H01L23/49811 ,  H01L33/62

Abstract: A chip package circuit board module includes a circuit board and an original chip. The circuit board includes a first pad and a second pad disposed besides the first pad and separated from the first pad. The original chip is connected to the first pad and the second pad. A width of the original chip is W1, a total width of the first pad is P1, and a total width of the second pad is P2. The total width P1 of the first pad is larger than twice of the width W1 of the original chip, and the total width P2 of the second pad is larger than twice of the width W1 of the original chip.