Invention Application
- Patent Title: METHOD OF FORMING NITRIDE FILM
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Application No.: US15420322Application Date: 2017-01-31
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Publication No.: US20170218517A1Publication Date: 2017-08-03
- Inventor: Noriaki FUKIAGE , Takayuki KARAKAWA , Akihiro KURIBAYASHI , Takeshi OYAMA , Jun OGAWA
- Applicant: TOKYO ELECTRON LIMITED
- Priority: JP2016-017022 20160201; JP2016-234902 20161202
- Main IPC: C23C16/511
- IPC: C23C16/511 ; C23C16/34 ; C23C16/455

Abstract:
A method of forming a nitride film in a fine recess formed in a surface of a substrate to be processed, by repeating a process, which includes adsorbing a film forming raw material gas onto the substrate and nitriding the adsorbed film forming raw material gas. The nitriding the adsorbed film forming raw material gas includes converting a NH3 gas as a nitriding gas, and an adsorption inhibiting gas for inhibiting adsorption of the NH3 gas into radicals and supplying the radicals onto the substrate.
Information query
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