Invention Application
- Patent Title: METHOD FOR COMPENSATING PROBE MISPLACEMENT AND PROBE APPARATUS
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Application No.: US15414852Application Date: 2017-01-25
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Publication No.: US20170219650A1Publication Date: 2017-08-03
- Inventor: Chen-Ching Chen , Yu-Hsun Hsu , Po-Yi Ting , Stojan Kanev
- Applicant: MPI Corporation
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01K13/00

Abstract:
A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.
Public/Granted literature
- US10312123B2 Method for compensating probe misplacement and probe apparatus Public/Granted day:2019-06-04
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