公开(公告)号：US11144198B2

公开(公告)日：2021-10-12

申请号：US16364747

申请日：2019-03-26

Applicant: MPI Corporation

Inventor： Chien-Hung Chen ,  Guan-Jhih Liou ,  Lin-Lin Chih ,  Stojan Kanev

IPC: G06F3/0488 ,  G06F3/0484 ,  G01R31/317 ,  G01R31/319 ,  G09G3/00

Abstract: A control method of a touch display apparatus applicable to a probe station is provided. The probe station includes a movable element. The movable element is a chuck stage, a camera stage, a probe platen, or a positioner. The control method of a touch display apparatus includes displaying a first window and a second window on a touch display apparatus; displaying an operation interface on the first window and displaying a real-time image on the second window; and detecting a touch instruction generated on the operation interface, where the movable element moves according to the touch instruction.

公开(公告)号：US20170018068A1

公开(公告)日：2017-01-19

申请号：US15062273

申请日：2016-03-07

Applicant: MPI Corporation

Inventor： Stojan Kanev ,  Chia-hung Hung ,  PING-YU HU ,  YAO-CHUAN CHIANG

IPC: G06T7/00 ,  H04N5/225 ,  H04N5/247

CPC classification number: H04N5/2251 ,  H04N5/247

Abstract: A probe device includes a case, a fixing base, a probe stage, a first camera and a first mirror. The case includes a bottom plate and a first side wall, which includes a first through hole and is vertically connected to the bottom plate. The fixing base, disposed inside the case, can move along a Z-axis direction. The probe stage, disposed inside the case, is used to carry a probe having a probe tip. The first camera is disposed outside the case and fixed to the first side wall. The first mirror is disposed relative to the first camera with a first angle formed between a surface of the first mirror and the normal line of the first camera. The first mirror can move along the Z-axis direction so that the first camera captures images of the probe tip through the first through hole via the first mirror.

Abstract translation: 探针装置包括壳体，固定基座，探针台，第一相机和第一反射镜。 壳体包括底板和第一侧壁，其包括第一通孔并垂直连接到底板。 设置在壳体内的固定基座能够沿Z轴方向移动。 设置在壳体内的探针台用于承载具有探针尖端的探针。 第一相机设置在壳体外部并固定到第一侧壁。 第一镜相对于第一照相机以第一镜的表面和第一照相机的法线之间形成的第一角度设置。 第一镜可以沿Z轴方向移动，使得第一照相机通过第一反射镜通过第一通孔捕获探针尖端的图像。

公开(公告)号：US10312123B2

公开(公告)日：2019-06-04

申请号：US15414852

申请日：2017-01-25

Applicant: MPI Corporation

Inventor： Chen-Ching Chen ,  Yu-Hsun Hsu ,  Po-Yi Ting ,  Stojan Kanev

IPC: G01R31/28 ,  H01L21/677 ,  A47B88/497 ,  A47B88/457 ,  G01K13/00 ,  H01L21/673 ,  G01R31/44 ,  A47B88/988

Abstract: A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.

公开(公告)号：US10048844B2

公开(公告)日：2018-08-14

申请号：US14996282

申请日：2016-01-15

Applicant: MPI Corporation

Inventor： Stojan Kanev ,  Yung-Chin Liu ,  Andrej Rumiantsev ,  Yao-Chuan Chiang

IPC: G06F3/0484 ,  G06F3/041 ,  G06F3/0488 ,  G01R31/28 ,  G03F7/20 ,  G01N21/95

Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

公开(公告)号：US20170219650A1

公开(公告)日：2017-08-03

申请号：US15414852

申请日：2017-01-25

Applicant: MPI Corporation

Inventor： Chen-Ching Chen ,  Yu-Hsun Hsu ,  Po-Yi Ting ,  Stojan Kanev

IPC: G01R31/28 ,  G01K13/00

CPC classification number: H01L21/6773 ,  A47B88/457 ,  A47B88/497 ,  A47B88/988 ,  G01K13/00 ,  G01R31/2891 ,  G01R31/44 ,  H01L21/67346 ,  H01L21/67386

Abstract: A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.

公开(公告)号：US12196779B2

公开(公告)日：2025-01-14

申请号：US17888500

申请日：2022-08-16

Applicant: MPI CORPORATION

Inventor： Stojan Kanev ,  Mei-Ting Lu ,  Sebastian Giessmann

IPC: G01R1/067 ,  G01B11/26 ,  G01R1/18 ,  G01R31/28 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272

Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

公开(公告)号：US11262401B2

公开(公告)日：2022-03-01

申请号：US16854926

申请日：2020-04-22

Applicant: MPI Corporation

Inventor： Stojan Kanev ,  Chia-Hung Hung

IPC: G01R31/28

Abstract: A wafer probe station includes a thermal chuck, a chuck stage, a platen, some probes, a first focusing device, a second focusing device and a thermal plate. The thermal chuck heats up to an operational temperature and holds a device under test (DUT). The chuck stage connects with the thermal chuck and moves the thermal chuck. The thermal chuck locates between the chuck stage and the platen. The probes are disposed on the platen and configured to contact with the DUT. The first focusing device is disposed on the platen to focus on the DUT. The second focusing device is disposed on the chuck stage to focus on the probes. The thermal plate locates between the second focusing device and the platen and is configured to heat up to the operational temperature. The thermal plate has a through hole aligning with the second focusing device.

公开(公告)号：US10096505B2

公开(公告)日：2018-10-09

申请号：US15414873

申请日：2017-01-25

Applicant: MPI Corporation

Inventor： Lin-Lin Chih ,  Chien-Hung Chen ,  Cheng-Rong Yang ,  Stojan Kanev

IPC: G01R31/01 ,  H01L21/677 ,  A47B88/497 ,  A47B88/457 ,  G01K13/00 ,  G01R31/28 ,  H01L21/673 ,  A47B88/988

Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.

公开(公告)号：US20160210028A1

公开(公告)日：2016-07-21

申请号：US14996282

申请日：2016-01-15

Applicant: MPI Corporation

Inventor： Stojan Kanev ,  Yung-Chin Liu ,  Andrej Rumiantsev ,  YAO-CHUAN CHIANG

IPC: G06F3/0484 ,  G06F3/0488 ,  G06F3/041

CPC classification number: G06F3/04845 ,  G01N21/9501 ,  G01R31/2808 ,  G03F7/7065 ,  G03F7/708 ,  G06F3/0412 ,  G06F3/04847 ,  G06F3/04883 ,  G06F2203/04806

Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

Abstract translation: 本公开提供了一种可用于具有可移动元件的半导体检查设备的方法来检查设备的操作方法。 该方法包括：通过触摸显示器显示晶片图形; 检测由所述触摸显示器产生的触摸信号; 当生成触摸信号时检测晶片图形的放大率; 以及当产生所述触摸信号时，基于所述晶片图形的放大率来确定所述可移动元件的移动速度。 此外，可以根据触摸信号来确定可移动元件的移动方向。 通过本公开，操作者可以更直观地操作半导体检查设备的每个可移动元件。

公开(公告)号：US10895587B2

公开(公告)日：2021-01-19

申请号：US16233051

申请日：2018-12-26

Applicant: MPI Corporation

Inventor： Yu-Hsun Hsu ,  Jhih-Wei Fang ,  Stojan Kanev ,  Sebastian Giessmann

IPC: G01R31/00 ,  G01R1/04 ,  G01R1/18 ,  G01R31/28 ,  G01R1/067

Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.