Invention Application
- Patent Title: SEMICONDUCTOR PROCESSING DEVICE
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Application No.: US15597100Application Date: 2017-05-16
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Publication No.: US20170250098A1Publication Date: 2017-08-31
- Inventor: Yii-Cheng Lin , Chih-Ming Sun , Pinyen Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B9/08 ; H01L21/306
Abstract:
A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.
Information query
IPC分类:
